Semiconductor die with staggered bond pads

Details Semiconductor die with staggered bond pads Semiconductor die with staggered bond pads

1996-06-07

1998-09-29

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257786, 257674, 438617, H01L 2348, H01L 2352

Patent

active

058148922

ABSTRACT:
Improved manufacturability, yield, and reliability are achieved during wirebonding of a semiconductor die of reduced size by employing two rows of staggered conductive connectors, or bond pads, for wirebonding the die to a semiconductor package. An outer row of conductive connectors is positioned closer to the edge of the die than an inner row of conductive connectors and includes a greater number of connectors than the inner row. The die can be wirebonded to a package substrate having either a single row of bondfingers or multiple rows of bondfingers. In one embodiment, bond wires attaching the inner row of conductive pad connectors to the package substrate have a greater loop height than bond wires attaching the outer row of conductive pad connectors to the package substrate.

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patent: 5497031 (1996-03-01), Kozono
patent: 5510654 (1996-04-01), Nishino et al.
patent: 5569964 (1996-10-01), Ikebe

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