Method of fabricating boron containing coatings

Details Method of fabricating boron containing coatings Method of fabricating boron containing coatings

1996-10-05

1999-04-27

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419226, 20419227, C23C 1434

Patent

active

058977511

ABSTRACT:
Hard coatings are fabricated from boron nitride, cubic boron nitride, and multilayer boron/cubic boron nitride, and the fabrication thereof involves magnetron sputtering in a selected atmosphere. These hard coatings may be applied to tools and engine and other parts, as well to reduce wear on tribological surfaces and electronic devices. These boron coatings contain no morphological growth features. For example, the boron is formed in an inert (e.g. argon) atmosphere, while the cubic boron nitride is formed in a reactive (e.g. nitrogen) atmosphere. The multilayer boron/cubic boron nitride, is produced by depositing alternate layers of boron and cubic boron nitride, with the alternate layers having a thickness of 1 nanometer to 1 micrometer, and at least the interfaces of the layers may be discrete or of a blended or graded composition.

REFERENCES:
patent: 4412899 (1983-11-01), Beale
patent: 4724169 (1988-02-01), Keem et al.
patent: 5203977 (1993-04-01), Makowiecki et al.
patent: 5232571 (1993-08-01), Braymen
patent: 5250327 (1993-10-01), Ogata et al.
patent: 5296119 (1994-03-01), Maustakas
patent: 5316804 (1994-05-01), Tomikawa et al.
McKernam et al., "Magnetron . . . Carbide", ICMCTF 91, Waldorf, MD, Apr. 1991.

Affiliated with

Also associated with

Rating

Method of fabricating boron containing coatings does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating boron containing coatings, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating boron containing coatings will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-683910