Method of bonding substrates, detector cell produced according t

Details Method of bonding substrates, detector cell produced according t Method of bonding substrates, detector cell produced according t

Filed on

1997-05-20

Date issued

2000-02-29

Examiner

Whitehead, Jr., Carl

Patent Class

Semiconductor device manufacturing: process

SubClass

Bonding of plural semiconductor substrates

Other Related Categories

438406, 438456, 438459, H01L 21265

Type

Patent

Status

active

Patent number

060308834

Description

ABSTRACT:
At a room temperature, cleaned glass substrates 8a, 8b are suitably positioned and placed one upon another. A hydrofluoric acid solution or alkaline solution 10 is dropped into the bonding interface between the glass substrates 8a, 8b. The hydrofluoric acid solution or alkaline solution thus dropped spreads along the bonding interface. At a room temperature, a load is then applied to the upper glass substrate 8a and allowed to stand for a suitable period of time, thus bonding the glass substrates to each other.

REFERENCES:
patent: 5207864 (1993-05-01), Bhat et al.
patent: 5362667 (1994-11-01), Linn et al.
patent: 5441591 (1995-08-01), Imuthrn et al.
Nakanishi, H. et al., Studies on SiO2-SiO2 Bonding with Hydrofluoric Acid-Room Temperature and Low Stress Bonding Technique for MEMS, Proceedings of the Eleventh Annual International Workshop on IEEE Micro Electro Mechanical Systems, pp. 609-614, 1998.

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