Structure and method for making a compliant lead for a microelec

Details Structure and method for making a compliant lead for a microelec Structure and method for making a compliant lead for a microelec

1995-11-21

1999-10-12

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, H01L 2144

Patent

active

059665920

ABSTRACT:
A method of treating a lead in a chip package. A conductive lead is positioned such that it extends across a gap in a dielectric substrate and is secured at either end to a first surface of the substrate. Directed energy is then applied to a desired portion of the surface of the lead within the gap. As a result of the application of energy, a surface layer of the lead is recrystallized thereby creating a fine grain, dense surface layer of lead material. Surface contaminates may be vaporized and contaminants at the grain boundaries of the recrystallized surface layers may be driven away from the grain boundaries such that a treated lead is more ductile and has better resistance to thermal cycling after the lead has been attached to a chip contact.

REFERENCES:
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5230144 (1993-07-01), Ootsuki
patent: 5491302 (1996-02-01), DiStefano et al.
patent: 5629239 (1997-05-01), DiStefano et al.
Park et al., A Practical Excimer Laser-Based Cleaning Tool for Removal of Surface Contaminants, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 17, Nov. 4, Dec. 1994, pp. 631-643.

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