Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1998-11-12
1999-10-12
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257779, 257780, H01L 2348, H01L 2352, H01L 2340
Patent
active
059659459
ABSTRACT:
An improved solder bump composition and method advantageously employs a thin low-alpha layer of lead (Pb) deposited in close proximity to alpha particle sensitive devices, while ordinary (i.e., low cost) Pb is used for the bulk of the solder bump. This approach allows for reduced overall cost while still providing protection from alpha-particle induced soft errors. The low-alpha layer reduces the flux of alpha particle into devices in two ways. First, the low-alpha layer is itself essentially Pb.sup.210 free and therefore alpha particle emissions from the low-alpha layer are negligible. Second, the low-alpha layer is substantially opaque to alpha particles emitted by the ordinary Pb which includes Pb.sup.210. As a result, sensitive circuits on a semiconductor chip employing the improved solder bump are shielded from alpha particle emissions of the low-cost Pb.sup.210 -containing portion of a solder bump.
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May, T. & Woods, M., "A New Physical Mechanism for Soft Errors in Dynamic Memories", Electron Devices Society and Reliablity Group of the IEEE, New York, Yy, 1978, pp. 33-40.
Joint Industry Standard, "Implementation of Flip Chip and Chip Scale Technology", IPC, Northbrook, IL, J-STD-012, Jan. 1996, pp. 1-105.
Hossain Tim Z.
Maile Bernd
Miller Roy Mark
Tiffin Don A.
Advanced Micro Devices , Inc.
Clark Sheila V.
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