Semiconductor device and a method of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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257296, 257306, 257307, 257308, 257309, 257752, 438632, 438698, 438703, 438926, H01L 2348

Patent

active

059659394

ABSTRACT:
A semiconductor device having a closed step portion and a global step portion including an insulating layer having a planarized surface on the global step portion is provided. A dummy pattern is formed by forming an insulating layer on the global step portion and then patterning through a photolithography process. After forming the dummy pattern for compensating steps in the global step portion and between the closed step portion and the global step portion, a BPSG layer is formed on both the closed step portion and the global step portion, and then the BPSG layer is heat-treated to cause it to reflow. The BPSG layer as an insulating interlayer having a planarized surface. The improved planarization decreases the occurrence of notching and discontinuities in the succeeding metallization processes thereby enhancing the yield and electrical characteristics of the semiconductor device.

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patent: 5218219 (1993-06-01), Ajika et al.
patent: 5386382 (1995-01-01), Ahn
patent: 5406103 (1995-04-01), Ogawa

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