Mask assembly having mask stress relieving feature

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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118 48, 118 49, 118504, 118505, 204192R, 204298, 427 34, 427 66, 427 69, 427 82, 427 96, 427109, 4272481, 427250, 427252, 427272, 427282, C23C 1500

Patent

active

046157816

ABSTRACT:
The present invention provides a means of relieving stress on an apertured mask, typically used to deposit thin-film structures on a glass substrate, such that the mask easily conforms to the substrate surface when the mask is in its hold down and patterning position during the deposition process. In particular, the present invention provides a mask assembly having a structurally relieved inner apertured mask portion from an outer mask portion that serves to eliminate wrinkles or crimps in the mask during deposition which may produce unacceptable blurs or shorts between thin-film structures. The stress relieving feature includes a slot which is disposed peripherally about the inner mask and two small segments providing the interconnection between the inner and outer mask of the mask assembly.

REFERENCES:
patent: 3510349 (1970-05-01), Jones
patent: 4049857 (1977-09-01), Hammer
patent: 4273812 (1981-06-01), Tsutsui et al.
patent: 4322277 (1982-03-01), Oprenko
patent: 4335161 (1982-06-01), Luo
patent: 4344988 (1982-08-01), Sono et al.
patent: 4391034 (1983-07-01), Stuby
patent: 4437966 (1984-03-01), Hope et al.
patent: 4511599 (1985-04-01), Rustomji
Ingle Rev. Sci. Inst. 45 (1974), pp. 1460-1461.
Addy et al. IBM Tech. Disc. Bull. 8 (Oct. 5) 1965, p. 719.

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