Method for thinning silicon

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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148175, 156653, 156657, 156662, 252 793, 427 86, 427 93, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

046157620

ABSTRACT:
A method for substantially uniformly thinning a silicon layer comprises providing a silicon layer having a surface, oxidizing substantially all of the surface so as to transform a uniformly thick layer of silicon into oxide, and removing all the oxide so as to expose the silicon layer.

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