Process for making metallized holes in a dielectric substrate by

Details Process for making metallized holes in a dielectric substrate by Process for making metallized holes in a dielectric substrate by

1989-02-27

1991-04-30

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430314, 430313, 430315, 430319, 430329, 204 15, G03C 500, C25D 502

Patent

active

050117610

ABSTRACT:
A process for making metallized holes in a dielectric substrate which, after galvanic growth of the conductive paths delimited by photoresist on the substrate, includes a drilling step of the substrate and electrogalvanic creation of rivets protruding beyond the edges of the holes on the front of the substrate. The steps of completion of the conductive and resistive paths on the front, deposition of metals on the back, reinforcement of the rivets and galvanic growth of the back and of the metals deposited inside the hole then follow.

REFERENCES:
patent: 4226932 (1980-10-01), Ferraris
Robert J. Thompson and Bradley W. Whitaker, "Conductive Via Processing Utilizing RF Sputtering and Selective Electrodeposition for Hybrid Thin Film Circuits"; Hewlett Packard Company (1982); pp. 536-542.

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