Sputtering cathode

Details Sputtering cathode Sputtering cathode

1992-10-20

1994-08-02

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429811, 20429819, C23C 1435

Patent

active

053342984

ABSTRACT:
The invention relates to a sputtering cathode operating on the magnetron principle, which has a cathode body equipped with a target having a sputtering surface and a peripheral surface. In back of the target a magnet system is provided which has poles of opposite polarity lying one opposite the other for the production of magnetic lines of force which issue from the target and, after traversing arcuate paths, re-enter the target. The marginal areas of the target lying outside of the erosion zone are covered over by an extension of the dark space shield which runs parallel to the sputtering surface and has an inner margin. The dark space shield 11 is electrically floating and is separated from the target by a gap which is so large that no plasma can ignite between the target and dark space shield, so that only the exposed target is sputtered.

REFERENCES:
patent: 4169031 (1979-09-01), Brors
patent: 4515675 (1985-05-01), Kieser et al.
patent: 4606802 (1986-08-01), Kobayashi et al.
patent: 5269896 (1993-12-01), Munemasa et al.

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