Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-05-06
1987-06-02
Godici, Nicholas P.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156622, 156DIG64, 156DIG88, 164463, 164479, C03B 1902, C03B 102
Patent
active
046700960
ABSTRACT:
In the production of a semi-conductor foil by solidification of a liquid semi-conductor on a horizontal support, the improvement which comprises positioning a molding body on the horizontal support, supplying the liquid semi-conductor to the molding body, and effecting relative movement between the molding body and support in a direction parallel to the support. Thereby fault-free silicon foils can readily be produced.
REFERENCES:
patent: 4233338 (1980-11-01), Ricard et al.
patent: 4323419 (1982-04-01), Wakefield
patent: 4330358 (1982-05-01), Grabmaier et al.
patent: 4468280 (1984-08-01), Bender et al.
patent: 4468281 (1984-08-01), Bender et al.
patent: 4484614 (1984-11-01), Maringer
Patent Abstracts of Japan, vol. 7, No. 86 (C-161)[1231], 4/9/83, "Production of p-n Junction Crystal Substrate".
Schwirtlich Ingo
Woditsch Peter
Bayer Aktiengesellschaft
Godici Nicholas P.
Seidel Richard K.
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