Process and apparatus for producing semi-conductor foils

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156622, 156DIG64, 156DIG88, 164463, 164479, C03B 1902, C03B 102

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046700960

ABSTRACT:
In the production of a semi-conductor foil by solidification of a liquid semi-conductor on a horizontal support, the improvement which comprises positioning a molding body on the horizontal support, supplying the liquid semi-conductor to the molding body, and effecting relative movement between the molding body and support in a direction parallel to the support. Thereby fault-free silicon foils can readily be produced.

REFERENCES:
patent: 4233338 (1980-11-01), Ricard et al.
patent: 4323419 (1982-04-01), Wakefield
patent: 4330358 (1982-05-01), Grabmaier et al.
patent: 4468280 (1984-08-01), Bender et al.
patent: 4468281 (1984-08-01), Bender et al.
patent: 4484614 (1984-11-01), Maringer
Patent Abstracts of Japan, vol. 7, No. 86 (C-161)[1231], 4/9/83, "Production of p-n Junction Crystal Substrate".

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