Method of making gang bonding interconnect tape for semiconducti

Details Method of making gang bonding interconnect tape for semiconducti Method of making gang bonding interconnect tape for semiconducti

1975-07-07

1977-12-20

Kendall, Ralph S.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29577R, 29624, 29625, 29626, 96 362, 148 62, 156644, 156664, 156666, 357 70, 427 96, 427 14, 427282, 427287, 427289, H05K 100

Patent

active

040639932

ABSTRACT:
A gang bonding interconnect tape for use in an automatic bonding machine for gang bonding of semiconductive devices is fabricated by depositing a series of electrically insulative support structures, such as rings of epoxy resin, onto a metallic tape, as of copper, there being at least one of said electrically insulative support structures for individual ones of the interconnect lead patterns to be formed in said metallic tape. The side of the metallic tape, opposite to the support structure, is photoetched with a series of interconnect lead patterns with individual ones of said lead patterns being etched in registration with individual ones of said electrically insulative support structures. The individual electrically insulative support structure, preferably in the form of a ring, is located in each of the lead patterns intermediate the central region thereof and the outer region thereof for supporting the individual leads thereof in circumferentially spaced relation.

REFERENCES:
patent: 3689991 (1972-12-01), Aird
patent: 3724068 (1973-04-01), Galli
patent: 3763404 (1973-10-01), Aird
patent: 3781596 (1973-12-01), Galli et al.
patent: 3904813 (1975-09-01), Groff

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