Chemical mechanical polishing apparatus with improved polishing

Details Chemical mechanical polishing apparatus with improved polishing Chemical mechanical polishing apparatus with improved polishing

1994-03-02

1997-07-01

Rose, Robert A.

Abrading

Abrading process

451 41, 451 43, 451285, 451288, 451291, 451388, B24B 100

Patent

active

056430531

ABSTRACT:
A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom. The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

REFERENCES:
patent: 34425 (1862-11-01), Schultz
patent: 2687603 (1954-08-01), White
patent: 2936555 (1960-05-01), Junge
patent: 3137977 (1964-06-01), Graves
patent: 3156073 (1964-11-01), Strasbaugh
patent: 3170273 (1965-02-01), Walsh
patent: 3342652 (1967-09-01), Reisman et al.
patent: 3559346 (1971-02-01), Paola
patent: 3748790 (1973-07-01), Pizzarello et al.
patent: 3841031 (1974-10-01), Walsh
patent: 3906678 (1975-09-01), Roth
patent: 3962832 (1976-06-01), Strasbaugh
patent: 3978622 (1976-09-01), Mazur et al.
patent: 3986433 (1976-10-01), Walsh et al.
patent: 4143490 (1979-03-01), Wood
patent: 4239567 (1980-12-01), Winings
patent: 4256535 (1981-03-01), Banks
patent: 4257194 (1981-03-01), Cailloux
patent: 4270316 (1981-06-01), Kramer
patent: 4373991 (1983-02-01), Banks
patent: 4380412 (1983-04-01), Walsh
patent: 4525954 (1985-07-01), Larsen
patent: 4653231 (1987-03-01), Cronkhite et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4726150 (1988-02-01), Nishio et al.
patent: 4839993 (1989-06-01), Masuko et al.
patent: 4918869 (1990-04-01), Kitta
patent: 4918870 (1990-04-01), Tobert et al.
patent: 4940507 (1990-07-01), Harbarger
patent: 4944836 (1990-07-01), Beyer et al.
patent: 4956313 (1990-09-01), Cote et al.
patent: 4992135 (1991-02-01), Doan
patent: 5020283 (1991-06-01), Tuttle
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5064683 (1991-11-01), Poon et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5114875 (1992-05-01), Baker et al.
patent: 5169491 (1992-12-01), Doan
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5209816 (1993-05-01), Yu et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5222329 (1993-06-01), Yu
patent: 5225034 (1993-07-01), Yu et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5255474 (1993-10-01), Gawa et al.
patent: 5297364 (1994-03-01), Tuttle
patent: 5302233 (1994-04-01), Kim et al.
patent: 5398459 (1995-03-01), Okumura et al.
Pp. 20 to 24 of EBARA CMP System Brochure.

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