Method of removing a carbon-contaminated layer from a silicon su

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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438680, 438719, 438725, 438906, 117 90, 117 92, 117 97, 216 64, 216 67, 216 79, 216 81, C30B 2504

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active

061071978

ABSTRACT:
A method of removing a carbon-contaminated layer from a silicon substrate surface before a silicon epitaxial growth on the silicon substrate surface. A carbon-contaminated layer on the silicon substrate is exposed to a chlorine radical to cause a chemical reaction of the chlorine radical with carbon atoms of the carbon-contaminated layer to generate chlorine carbide to form chlorine carbide for removal of the carbon-contaminated layer from the silicon substrate surface, wherein the chlorine radical has been generated by passing a chlorine gas through a heating filament so that the chlorine radical is generated at a much higher generation efficiency than when the chlorine radical were generated by using a deep ultraviolet ray. This means that the use of the filament for generating the chlorine radical at the higher generation efficiency results in a larger amount of the chlorine radical to be irradiated onto the carbon-contaminated layer and then reacted with carbon atoms to generate chlorine carbide at a higher efficiency whereby carbon on the silicon substrate surface or the carbon-contaminated layer may be removed therefrom at a higher efficiency. The epitaxial growth of the silicon layer on the carbon-free or carbon pile-up free silicon substrate surface results in the epitaxial silicon layer having a high crystal quality or crystal perfection.

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