Thin, high leadcount package

Details Thin, high leadcount package Thin, high leadcount package

1993-02-01

1994-03-01

Thomas, Tom

Fishing, trapping, and vermin destroying

437209, 437211, 437214, 437220, H01L 2160

Patent

active

052907350

ABSTRACT:
A high leadcount surface mount IC package. The IC package of the present invention includes a plastic molded compound which is localized over the surface of the die, such that it covers the interconnections of the die. The package includes a leadframe having many leads. The leads are supported using a ring support structure.

REFERENCES:
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4837184 (1989-06-01), Lin et al.

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