Semiconductor device and semiconductor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

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257706, 257713, 257717, 361709, 361716, 361719, H01L 2322, H01L 2324

Patent

active

057478767

ABSTRACT:
It is an object to facilitate assembly of an application device. A device (101) is provided with a heat sink (51) to radiate loss heat of an IGBT element (11) as a power semiconductor element to an external radiation fin. External terminals (5 and 6) connected to an external circuit substrate protrude in the direction in which the exposed surface of the heat sink (51) is directed. Accordingly, when assembling an application device by mounting the device (101) on the external circuit substrate together with other circuit elements, it is possible to mount the device (101) and other circuit elements together on the common main surface of the circuit substrate, i.e., on its main surface on the side opposite to the side where the radiation fin is attached. Accordingly, it is possible to collectively apply solder on the common main surface of the circuit substrate and collectively solder the device (101) and the other circuit elements.

REFERENCES:
patent: 4698662 (1987-10-01), Young et al.
patent: 4916502 (1990-04-01), Oshima
patent: 5057906 (1991-10-01), Ishigami
patent: 5198887 (1993-03-01), Brown
patent: 5457605 (1995-10-01), Wagner et al.
patent: 5539253 (1996-07-01), Nagaune

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