Method for the production of a light conducting structure with i

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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148188, 156659, H01L 744

Patent

active

040802442

ABSTRACT:
A method of producing a light conductor structure having a pair of light conductors embedded in a substrate and electrodes arranged between the light conductors which structure is particularly adapted to be used as an electrically controllable coupler, characterized by providing a substrate, applying a strip of diffusion material on the substrate at the location of each of the light conductors, covering each of the strips of diffusion material with a protective layer of material, applying a metal layer to the substrate and the layer of protective material, removing the protective layer and the metal layer supported thereon, and then diffusing the diffusion material into the substrate by heating to a desired temperature. The embodiments of the method include applying an adhesive layer prior to applying the metal layer to facilitate the attachment of the metal layer on the substrate and applying a dielectric layer prior to applying either the metal layer or the adhesive layer to prevent diffusion of either the adhesive or metal layer into the substrate during the diffusion process.

REFERENCES:
patent: 3629018 (1971-12-01), Henderson et al.
patent: 3740280 (1973-06-01), Ronen
patent: 3856588 (1974-12-01), Hashimoto et al.
patent: 3914137 (1975-10-01), Huffman et al.
patent: 3994758 (1976-11-01), Ogawa et al.

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