Staggered bond finger design for fine pitch integrated circuit p

Details Staggered bond finger design for fine pitch integrated circuit p Staggered bond finger design for fine pitch integrated circuit p

1996-03-29

1998-03-31

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361764, 361772, 174 524, 257723, 257724, 257777, 257784, H05K 111

Patent

active

057345597

ABSTRACT:
An integrated circuit package which has a plurality of bond fingers arranged in a staggered row arrangement on a bond shelf of the package. The bond shelf contains a first row of bond fingers that are separated by a plurality of spaces. The bond shelf also has a second row of bond fingers which each have a bond pad and a lead trace that extends through the spaces of the first row of bond fingers.

REFERENCES:
patent: 5468999 (1995-11-01), Lin et al.

Affiliated with

Also associated with

Rating

Staggered bond finger design for fine pitch integrated circuit p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Staggered bond finger design for fine pitch integrated circuit p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Staggered bond finger design for fine pitch integrated circuit p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-56706