Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-04-25
1985-01-22
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
118 50, 118718, 118719, 118720, 134 21, 134 32, 134 34, 156345, 226 97, 406 86, 427 85, 4272555, 427299, 430434, B44C 122, B08B 504, C23C 1308, B05D 512
Patent
active
044950241
DESCRIPTION:
BRIEF SUMMARY
The invention relates to a method and apparatus to apply a film of fluid medium on a surface. Thereby use is made of submicro-filtered gaseous environment for this surface during the applying of such a film.
The substrates, processed in that way, can be used in the microelectronica with the processing of silicon wafers and the like.
In the Dutch patent application No. 8 101 440 of the Applicant an apparatus is disclosed for the applying of fluid medium on a substrate, whereby a guide wall has been used, along which the surface of the substrate to be processed is displaceable under direct contact with the wall, before in the process section medium is fed to this substrate. Thereby under vacuum force such substrate is urged against this wall. By extending the outlets of the media towards near the extension of this guide wall a micro passage is obtained between the separation walls of such outlets and the substrate, in which passage media can flow along this substrate to the discharge channel.
The disadvantages of the apparatus with guide walls for the substrates are the following:
1. During the displacement of the substrate under vacuum force along such wall submicro particles can be removed from this substrate and as contamination affect the applied coating.
2. Via vacuum channels, positioned in such guide wall, coating or other medium can be suctioned on and seal off these channels.
3. After passing of the coating supply channel, the substrate can again take its original shape, and due to deformation thereof the touching of the passage wall of the cabin.
4. The suction forces can be too small, with irregularities in width of the passage and consequently variations in supply and discharge of the media.
5. There is no supply possible of high pressurized media to the substrate.
6. Variation in thickness of the substrate can cause a damage thereof.
7. After the applying of coating, the coated substrate surface may not be touched.
With the apparatus and method according to the invention these shortcomings are eliminated. Thereby the creation and maintaining of such media cushions in the passage aside the substrates, that at least the central section of such substrates cannot touch the wall of the supply- and discharge channels.
The substrates, used in the micro-electronica, have very small variations in thickness and have narrow tolerances in unflatness and bow. Consequently, the passage sections aside these substrates can be very narrow with a corresponding low consumption of media to maintain such cushion. The very limited height of the media cushions enables a large force of process media on the substrates with consequently a strong whirling action in these passage sections of the media. Due to this whirling action the processing is very intensive and so the length of processing is restricted. Also a continuous displacement of the substrates is possible during the processing.
The consumption of fluids and gaseous medium per substrate processed is limited and completely allowable in view of the high cost price of such substrates.
Further details regarding the apparatus and method follow from the description of the following Figures:
FIG. 1 is an enlarged perspective detail of the cabin, through which by means of micro media cushions the substrates are transported without contact with the environment.
FIG. 2 is a vertical cross section of an apparatus, in which the cabin according to FIG. 1 is used.
FIG. 3 is a horizontal cross section of the apparatus according to FIG. 2.
FIG. 4 is an enlarged detail of the cross section according to FIG. 2 at the inlet section thereof.
FIG. 5 is an enlarged detail of the cross section according to FIG. 2 at the discharge section thereof.
FIG. 6 shows a segment package with supply- and discharge channels.
FIG. 7 is a partial cross section of the apparatus according to FIG. 2, in which over two segments supply channels for gaseous medium are shown.
FIG. 8 is a longitudinal cross section of the segment according to FIG. 7.
FIG. 9 is an enlarged detail of the segment according t
REFERENCES:
patent: 4081201 (1978-03-01), Hassan et al.
patent: 4226526 (1980-10-01), Spence-Bate et al.
patent: 4278366 (1981-07-01), Loveless et al.
Olsen Warren E.
Powell William A.
Semmes David H.
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