Thermal grease insertion and retention

Details Thermal grease insertion and retention Thermal grease insertion and retention

1997-05-05

2000-01-18

Guay, John

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257717, 438122, 438125, 361713, 361719, 361705, H01L 2342

Patent

active

060160063

ABSTRACT:
An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The cover plate is separated from the integrated circuit by a small space. The cover plate has a pair of ports which allow a thermal grease to be injected into the space between the integrated circuit and the cover plate. The package has a seal that extends around the integrated circuit between the cover plate and the substrate. The seal controls and confines the thermal grease to an area immediately adjacent to the integrated circuit.

REFERENCES:
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patent: 4034469 (1977-07-01), Koopman et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4226281 (1980-10-01), Chu
patent: 4235283 (1980-11-01), Gupta
patent: 4514752 (1985-04-01), Engel et al.
patent: 4531146 (1985-07-01), Cuzchaw
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4933747 (1990-06-01), Schroeder
patent: 5184211 (1993-02-01), Fox
patent: 5323292 (1994-06-01), Brzezinski

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