High density interconnect structure with top mounted components

Details High density interconnect structure with top mounted components High density interconnect structure with top mounted components

1990-04-05

1993-04-06

James, Andrew J.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361397, 361400, 257668, H01L 2302, H01L 2316, H05K 100, H05K 702

Patent

active

052008100

ABSTRACT:
The functionality, versatility and connection and packing density of a high density interconnect structure is enhanced by mounting one or more components on top of the high density interconnect structure for connection to conductors of the high density interconnect structure and the chips embedded within the high density interconnect structure. Both active and passive components may be mounted in this manner, as may components which would be adversely affected by high density interconnect structure fabrication temperatures or by the presence of the high density interconnect structure dielectric.

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