Method for pattern-wise etching of a metallic coating film

Details Method for pattern-wise etching of a metallic coating film Method for pattern-wise etching of a metallic coating film

1983-07-18

1984-10-02

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156653, 156656, 156657, 1566591, 1566611, 204192E, 252 791, 430317, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044746423

ABSTRACT:
The invention provides an improved process for providing wirings and electrodes of aluminum film on the surface of a substrate. Instead of the conventional method of directly forming an organic resist layer on the metal film, a remarkable improvement in the fineness and accuracy of patterning is obtained by providing a subsidiary masking layer, mainly composed of silicon dioxide, between the metal film and the organic resist layer; and pattern-wise etching by first etching the subsidiary masking layer through a patterned mask of the organic resist layer with a fluorine-containing etching gas to form a patterned subsidiary masking layer, and then etching the metal film with a chlorine-containing etching gas through the mask of the patterned subsidiary masking layer, followed by final removal of the remaining subsidiary masking layer.

REFERENCES:
patent: 4184909 (1980-01-01), Chang et al.
patent: 4352724 (1982-10-01), Sugishima et al.

Affiliated with

Also associated with

Rating

Method for pattern-wise etching of a metallic coating film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for pattern-wise etching of a metallic coating film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for pattern-wise etching of a metallic coating film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-525671