Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-07-02
2000-02-22
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156232, 156240, 156247, 156289, 427152, 216 41, B44C 1165, B44C 122, B32B 3100, B41M 312
Patent
active
060275952
ABSTRACT:
Optical structures are replicated in photoresist on a substrate using a stamp. The transfer of the pattern into the liquid photoresist and the provision on the substrate can be achieved using manual pressures. Various techniques may be used to remove air from the liquid photoresist. The stamp is removed once the liquid photoresist is fully solidified. These structures in solidified photoresist may serve as optical elements or may be accurately transferred into the substrate. The stamp may be for an entire wafer.
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Lorengo J. A.
Osele Mark A.
Samsung Electronics Co,. Ltd.
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