Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Patent
1998-12-18
2000-02-22
El-Arini, Zeinab
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
134 32, 134 34, 134 36, 134 37, 134 952, 134902, B08B 304, B08B 500
Patent
active
06027574&
ABSTRACT:
A method of removing liquid on a substrate, the method comprising the steps of placing the substrate in a fluid reservoir having a surface level, maintaining a partial pressure of vapor over the fluid surface level, lowering the fluid surface level of the reservoir while adding fluid, whereby the liquid flows off the substrate, and holding the substrate at different holding points, while lowering the fluid surface level so that the lowering surface level does not pass across a holding point that is being used to hold the substrate.
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Li, et al., "Improvement and Evaluation of Drying Techniques for HF-last Wafer Cleaning," Pokorny GmbH, Hufingerstr. 35, D-78166 Donaueschingen, Germany (Interuniversity Microelectronic Center (IMEC), Kapeldreef 75, B-3001 Leuven, Belgium) No date.
Locke, et al., "Marangoni Drying: A New Concept for Drying Silicon Wafers," Pokorny GmbH, Hufingerstr. 35, D-78166 Donaueschingen, Germany (Interuniversity Microelectronic Center (IMEC), Kapeldreef 75, B-3001 Leuven, Belgium) No date.
Pokorny Brochure--Pokorny GmbH, Hufingerstr. 35, D-78166 Donaueschingen, Germany (Interuniversity Microelectronic Center (IMEC), Kapeldreef 75, B-3001 Leuven, Belgium) No date.
Fishkin Boris
Hearne John S.
Lowrance Robert B.
Applied Materials Inc.
El-Arini Zeinab
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