Wafer polishing apparatus

Details Wafer polishing apparatus Wafer polishing apparatus

1998-08-10

2000-02-22

Eley, Timothy V.

Abrading

Machine

Rotary tool

451287, 451288, 451289, 451 5, B24B 500, B24B 2900

Patent

active

060273984

ABSTRACT:
A wafer is polished while it is pressed against a polishing cloth through a pressure air layer, and a polished surface adjustment ring as well as the wafer are pressed against the polishing cloth. The wafer is polished in the state wherein a collapsing position of the polished surface adjustment ring with respect to the polishing cloth is set in such a way that the polishing pressure which is applied from the polishing cloth to the wafer can be constant.

REFERENCES:
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5803799 (1998-09-01), Volodarsky et al.
patent: 5879220 (1999-03-01), Hasegawa et al.

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