Process for making substantially smooth diamond

Details Process for making substantially smooth diamond Process for making substantially smooth diamond

1992-11-13

1994-04-05

Quach, T. N.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 437228, 437190, 51281R, 51283R, H01L 2100

Patent

active

053001885

ABSTRACT:
The present invention provides a process for making a diamond layer having a substantially smooth upper surface and a predetermined thickness on a substrate. The process includes depositing a patterned polish stopping layer on a substrate to a predetermined thickness while leaving predetermined portions of the substrate exposed. A diamond layer is than deposited on the polish stopping layer and on the predetermined portions of the substrate left exposed. The diamond layer is polished down to the polish stopping layer thereby forming a diamond layer on the substrate having a thickness substantially equal to the predetermined thickness of the polish stopping layer. The polish is conducted by a method that includes the mechanical and/or chemical consumption of the diamond layer. The polish stopping layer is capable of substantially stopping the consumption of the diamond layer.

REFERENCES:
patent: 4643161 (1987-02-01), Kim
patent: 4806900 (1989-02-01), Fujimori et al.
patent: 4863529 (1989-09-01), Imai et al.
patent: 4925701 (1990-05-01), Jansen et al.
patent: 5002899 (1991-03-01), Geis et al.
patent: 5006914 (1991-04-01), Beetz, Jr.
patent: 5066938 (1991-11-01), Kobashi et al.
patent: 5070040 (1991-12-01), Pankove
patent: 5071677 (1991-12-01), Patterson
patent: 5082359 (1992-01-01), Kirkpatrick
patent: 5086014 (1992-02-01), Miyata et al.
patent: 5099296 (1992-03-01), Mort et al.
patent: 5127983 (1992-07-01), Imai et al.
patent: 5131963 (1992-07-01), Ravi
patent: 5136344 (1992-08-01), Pronko
patent: 5154023 (1992-10-01), Sioshansi
patent: 5246884 (1993-09-01), Jaso et al.
W. E. Mutter, "Choice Stop Material for Chemical/Mechanical Polish Planarization," IBM Tech. Disc. Bull., vol. 27, No. 8, Jan. 1985, p. 4642.
S. Jin et al. Massive thinning of diamond films by a diffusion process, Appl. Phys. Lett., 60 pp. 1948-1950 (1992).
A. B. Harker et al., The polishing of polycrystalline diamond films, SPIE 1325 pp. 222-229, Jul. (1990).
Yoshikawa, Development and performance of a diamond film polishing apparatus with hot metals SPIE 1325 pp. 210-221 Jul. (1990).
T. Roppel et al. Thin film diamond microstructure applications, pp. 311-318 (1991).
"Thin Film Diamond Microstructure Applications," Y. Tzeng, M. Yoshikawa, M. Murakawa, A. Feldman, Ed. Elsevier Science Publishers B.V., 1991, pp. 311-318.

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