Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-03-02
1999-12-21
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
2575735, 2575734, H01L 2348
Patent
active
060052880
ABSTRACT:
A compliant contact system for making a temporary electrical connection with a semiconductor die for testing and a method for fabricating the compliant contact system are provided. The compliant contact system is adapted for use with a test apparatus for known good die. The compliant contact system includes an interconnect, and can include an alignment fixture for aligning the die with the interconnect. The interconnect includes a pattern of compliant contacts adapted to contact the bond pads on the die. The compliant contacts are formed as metal traces on a silicon substrate. The end portions of the metal traces are cantilevered over a pit etched into the substrate, and are adapted to flex to compensate for dimensional variations in the bond pads and to provide a bias force against the bond pads.
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Yamamoto, Yasuhiko et al., "Evaluation of New Micro-Connection System Using Microbumps", Nitto Denko technical report, ISHM '93 Proceedings, pp. 370-378.
Akram Salman
Farnworth Warren M.
Clark Sheila V.
Gratton Stephen A.
Micro)n Technology, Inc.
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