Process for producing mutually spaced conductor elements on a su

Details Process for producing mutually spaced conductor elements on a su Process for producing mutually spaced conductor elements on a su

1987-11-17

1990-06-05

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156664, 437228, 437246, 437944, H01L 2100, H01L 21283, H01L 21308

Patent

active

049311379

ABSTRACT:
The invention relates to a process for producing on a substrate conductor elements which are mutually spaced by a submicron dimension.
This process comprises the stages of producing on substrate (1) spacers, whose dimensions and spacing are a function of the dimensions and spacing of the elements (11a) to be produced, anisotropic deposition on the substrate and perpendicular thereto of the material (11a) constituting the spacers and elimination of said spacers.
The invention applies to the production of any random elements and particularly to the production of slightly mutually spaced electric conductors.

REFERENCES:
patent: 4083098 (1978-04-01), Nicholas
patent: 4108717 (1978-08-01), Widmann
patent: 4502914 (1985-03-01), Trumpp et al.
patent: 4648937 (1987-03-01), Ogura et al.
patent: 4784718 (1988-11-01), Mitani et al.
Emmanuel, "Low Temperature Lift-Off Process" IBM TDB, vol. 24, No. 6, pp. 2964-2965, Nov. 1981.
Geelen et al., "Polyimide Lift Off for Submicrometer Metallisation Patterns", Microelectronic Engin., vol. 3, pp. 499-505, Dec. 1985.

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