Method of using laser routing to form a rigid/flex circuit board

Details Method of using laser routing to form a rigid/flex circuit board Method of using laser routing to form a rigid/flex circuit board

1989-08-15

1990-06-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 156633, 156643, 156645, 156655, 156668, 156150, 1562728, 156902, 21912169, 21912185, 174254, 427 96, 428209, 428901, B44C 122, B29C 3700, C03C 1500, C23F 102

Patent

active

049311344

ABSTRACT:
A method of fabricating a multilayer circuit board having rigid and flexible sections using Z-axis laser routing. A rigid superstructure is provided for lamination to a flexible circuit substrate, wherein the superstructure includes specially configured strips of laser reflective material, disposed on the laminating surface thereof, defining the boundary between the rigid and flexible sections of the multilayer circuit board. In subsequent processing, a beam of laser energy is directed through the rigid superstructure, along the Z-axis thereof, superjacent to each strip of laser reflective material, thereby cutting through the material of the superstructure creating a laser routed channel which forms an interface between the rigid and flexible sections of the finished multilayer circuit board. In a further step, the portion of the rigid superstructure residing between the laser routed channels is separated and removed, there by exposing the underlying flexible substrate, resulting in a flexible section on an otherwise rigid laminated composite and creating a multilayer rigid/flex circuit board.

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