Method of connecting electronic element to base plate

Details Method of connecting electronic element to base plate Method of connecting electronic element to base plate

1988-03-29

1989-03-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 156656, 1566591, 156902, 427 96, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

048140406

ABSTRACT:
An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.

REFERENCES:
patent: 2739881 (1956-03-01), Kepple
patent: 4157932 (1979-06-01), Hirata
patent: 4540463 (1985-09-01), Kakuhashi et al.

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