Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1998-08-25
2000-10-17
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257780, 257781, 257347, H01L 2302
Patent
active
061336254
ABSTRACT:
A semiconductor device for protecting an electronic circuit from a surge and a method for manufacturing the semiconductor device are obtained. The semiconductor device comprises a p-type semiconductor substrate 13, an insulator 14 enclosing a SOI layer 111 on which an electronic circuit is formed, and provided on the semiconductor substrate 13, a bonding pad 121 conducted to the SOI layer 111 through a wiring 113, and a bonding region 12 including the bonding pad 121 and an opening 122 having a bottom to which the semiconductor substrate 13 is exposed. A bonding wire 3 is bonded to the bonding region 12.
REFERENCES:
patent: 5113236 (1992-05-01), Arnold et al.
patent: 5235212 (1993-08-01), Shimizu et al.
patent: 5365112 (1994-11-01), Ohshima
patent: 5382818 (1995-01-01), Pein
patent: 5539244 (1996-07-01), Mori et al.
patent: 5567968 (1996-10-01), Tsuruta et al.
patent: 5587598 (1996-12-01), Hatanaka
patent: 5700735 (1997-12-01), Shine et al.
patent: 5719448 (1998-02-01), Ichikawa
patent: 5739591 (1998-04-01), Dekker et al.
patent: 5773899 (1998-06-01), Zambrano
patent: 5814893 (1998-09-01), Hsu et al.
patent: 5841172 (1998-11-01), Morishita et al.
ULSI Dram Technology, Sep. 25, 1992, p. 67.
German Office Action with English translation.
Clark Jhihan B
Hardy David
Mitsubishi Denki & Kabushiki Kaisha
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