Apparatus and method for automating the underfill of flip-chip d

Details Apparatus and method for automating the underfill of flip-chip d Apparatus and method for automating the underfill of flip-chip d

1997-11-24

1999-08-24

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257787, H01L 2348

Patent

active

059427981

ABSTRACT:
An apparatus and method for underfilling a silicon chip (16) to a substrate (12) by depositing an underfill dam (18) on the surface (20) of the substrate (12) prior to addition of the underfill material (14), is disclosed. A bead of underfill material (14) is provided on the substrate (12) about the periphery of the silicon chip (16), within the underfill dam (18). The underfill material (14) fills the gap (22) between the electrical contacts, the substrate (12) and the silicon chip (16) by capillary action and differential pressure created by a vacuum system (40).

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