Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-11-20
1997-03-11
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566361, H01L 2100
Patent
active
056097182
ABSTRACT:
The inventive apparatus is a wafer planarizer that has a movable platen, a polishing pad positioned on the platen, a wafer carrier positioned opposite the polishing pad, and a measuring device that is engagable with the polishing pad. The polishing pad decreases as the wafer is conditioned in a straight line correlation with the resulting polishing rate of a wafer. The wafer is attachable to the wafer carrier, and it may be moved with the carrier to be selectively engaged with the polishing pad to planarize the wafer at a wafer polishing rate under a set of wafer polishing operating parameters. After the wafer is planarized, the pad is conditioned by removing a layer of material from the planarizing surface of the pad under a set of conditioning parameters. The measuring device measures the decrease in the thickness of the polishing pad after the pad is conditioned, and it correlates the actual decrease in pad thickness with an expected change in pad thickness. When the same pad conditioning parameters are used from one pad conditioning cycle to the next, a difference between the actual decrease in pad thickness and the expected change in pad thickness indicates a change in operating parameters.
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Dang Thi
Micro)n Technology, Inc.
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