Plasma processing apparatus and the upper electrode unit

Details Plasma processing apparatus and the upper electrode unit Plasma processing apparatus and the upper electrode unit

2010-09-30

2011-12-27

Lund, Jeffrie R (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C156S345330, C156S345340, C156S345430, C118S7230ER, C118S715000

Reexamination Certificate

active

08083891

ABSTRACT:
In a plasma processing apparatus that executes plasma processing on a semiconductor wafer placed inside a processing chamber by generating plasma with a processing gas supplied through a gas supply hole at an upper electrode (shower head) disposed inside the processing chamber, an interchangeable insert member is inserted at a gas passing hole at a gas supply unit to prevent entry of charged particles in the plasma generated in the processing chamber into the gas supply unit. This structure makes it possible to fully prevent the entry of charged particles in the plasma generated inside the processing chamber into the gas supply unit.

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