Thermal reactor with improved gas flow distribution

Details Thermal reactor with improved gas flow distribution Thermal reactor with improved gas flow distribution

2008-12-19

2011-11-15

Estrada, Michelle (Department: 2829)

Coating apparatus

With means to apply electrical and/or radiant energy to work...

Radiant heating

C438S618000, C438S648000, C438S679000, C438S680000, C438S681000, C438S685000, C257SE23163, C257SE21593

Reexamination Certificate

active

08056500

ABSTRACT:
Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.

REFERENCES:
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patent: 2005/0011436 (2005-01-01), Liu
patent: 2007/0084406 (2007-04-01), Yudovsky et al.
patent: 2007/0087533 (2007-04-01), Nishikawa et al.
patent: 2007/0292614 (2007-12-01), Liu et al.
patent: 2009/0178611 (2009-07-01), Arena et al.
patent: 1 132950 (2001-09-01), None
PCT International Search Report and Written Opinion dated Jul. 27, 2009 for International Application No. PCT/US2008/087496. (APPM/011945 PCT).

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