Integrated circuit package system with offset stacking

Details Integrated circuit package system with offset stacking Integrated circuit package system with offset stacking

2007-12-12

2011-12-27

Monbleau, Davienne (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S685000, C257S686000, C257S723000, C257S724000, C257S777000, C257S787000, C257SE23151

Reexamination Certificate

active

08084849

ABSTRACT:
An integrated circuit package system includes: providing an interposer having a bond pad and a contact pad; mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier; connecting an electrical interconnect between bond pad and the carrier; and forming a package encapsulation over the carrier and the electrical interconnect with both the contact pad and the exposed side of the interposer not covered.

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