Method of making connections in a back-lit circuit

Details Method of making connections in a back-lit circuit Method of making connections in a back-lit circuit

2009-04-28

2011-11-08

Nguyen, Ha Tran T (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S614000, C438S629000, C438S637000, C438S639000, C257S774000, C257S758000, C257S204000

Reexamination Certificate

active

08053353

ABSTRACT:
A method for forming, on a surface of a thinned-down semiconductor substrate, a contact connected to a metal track of an interconnect stack formed on the opposite surface of the thinned-down substrate, including the steps of: forming, on the side of a first surface of a substrate, an insulating region penetrating into the substrate and coated with a conductive region and with an insulating layer crossed by conductive vias, the vias connecting a metal track of the interconnect stack to the conductive region; gluing the external surface of the interconnect stack on a support and thinning down the substrate; etching the external surface of the thinned-down substrate and stopping on the insulating region; etching the insulating region and stopping on the conductive region; and filling the etched opening with a metal.

REFERENCES:
patent: 5739587 (1998-04-01), Sato
patent: 6656828 (2003-12-01), Maitani et al.
patent: 7285477 (2007-10-01), Bernstein et al.
patent: 7391114 (2008-06-01), Mimura et al.
patent: 7679180 (2010-03-01), Tsao et al.
patent: 7863705 (2011-01-01), Yamazaki
patent: 2001/0026001 (2001-10-01), Yagi
patent: 2005/0104148 (2005-05-01), Yamamoto et al.
patent: 2006/0033168 (2006-02-01), Umemoto et al.
patent: 2006/0183265 (2006-08-01), Oh et al.
patent: 2008/0246152 (2008-10-01), Liu et al.
patent: 2010/0314776 (2010-12-01), Blanchard
patent: 2 910 705 (2008-06-01), None
patent: 06275803 (1994-09-01), None
patent: 2005191492 (2005-07-01), None
patent: WO 2008074691 (2008-06-01), None
French Search Report dated Jan. 26, 2009, from corresponding French Application No. 08/52950, filed Apr. 30, 2008.

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