Single side workpiece processing

Details Single side workpiece processing Single side workpiece processing

2006-02-22

2011-12-27

Perrin, Joseph L (Department: 1711)

Cleaning and liquid contact with solids

Apparatus

With movably or flexibly mounted spray or jet applying...

C134S181000, C134S200000, C294S064200, C294S064300

Reexamination Certificate

active

08082932

ABSTRACT:
A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. The rotor may have cylindrical side walls joined to a top plate, and with the gas inlets located in the cylindrical sidewalls. The head is moveable into engagement with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece.

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