Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-09-26
2011-10-04
Pham, Thanhha (Department: 2894)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S765000, C257SE21586
Reexamination Certificate
active
08030212
ABSTRACT:
An atomic-layer-deposition process for forming a patterned thin film comprising providing a substrate, applying a deposition inhibitor material to the substrate, wherein the deposition inhibitor material is an organic compound or polymer; and patterning the deposition inhibitor material either after step (b) or simultaneously with applying the deposition inhibitor material to provide selected areas of the substrate effectively not having the deposition inhibitor material. An inorganic thin film material is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.
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Cowdery-Corvan Peter J.
Freeman Diane C.
Irving Lyn M.
Levy David H.
Yang Cheng
Eastman Kodak Company
Konkol Chris P.
Pham Thanhha
Tucker J. Lanny
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