Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2010-06-18
2011-12-27
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S724000, C257S783000, C257SE23169
Reexamination Certificate
active
08084868
ABSTRACT:
In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including at least two electronic components which are provided in a stacked arrangement, and are each electrically connected to an underlying substrate through the use of conductive wires. In accordance with one embodiment of the present invention, the electronic components are separated from each other by an intervening spacer which is typically fabricated from aluminum, or from silicon coated with aluminum. In this particular embodiment, the uppermost electronic component of the stack is electrically connected to at least one of the conductive wires through the use of a conductive paste layer which is also used to secure the uppermost electronic component to the underlying spacer. In this regard, one end of one of the conductive wires may be embedded in the conductive paste layer adjacent one side of the uppermost electronic component, or between the bottom surface of such electronic component and the spacer.
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Perelman Vladimir
St. Amand Roger D.
Amkor Technology Inc.
Ho Tu-Tu
Stetina Brunda Garred & Brucker
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