Lead assembly for a flip-chip power switch

Details Lead assembly for a flip-chip power switch Lead assembly for a flip-chip power switch

2008-12-24

2011-12-27

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S775000, C361S780000, C257S666000

Reexamination Certificate

active

08085553

ABSTRACT:
A power switch assembly includes a flip-chip type integrated circuit chip and a lead-frame with a plurality of spaced apart parallel lead sections. The flip-chip type integrated circuit chip includes a distributed transistor, and first and second pluralities of flip-chip interconnects connected to source and drain regions, respectively. The first and second lead sections at least partially overlap along the first axis. Each of the plurality of lead sections includes a contact portion and an extended portion extending laterally from the contact portion. The extended portions of the first and second lead section extend from the contact portion in opposite directions. The first side of the first and second lead section contacts at least two of the first and plurality of flip-chip interconnects, respectively. The second side of the first and second lead are configured to contact a first and second contact area on a printed circuit board, respectively.

REFERENCES:
patent: 5038197 (1991-08-01), Satriano
patent: 5945730 (1999-08-01), Sicard et al.
patent: 6713823 (2004-03-01), Nickel
patent: 2008/0035959 (2008-02-01), Jiang

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