Permanent mandrel for making bumped tapes and methods of forming

Details Permanent mandrel for making bumped tapes and methods of forming Permanent mandrel for making bumped tapes and methods of forming

1984-11-28

1986-01-14

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204281, C25D 120, C25D 122, C25D 1710

Patent

active

045644233

ABSTRACT:
Reusable mandrels for fabricating bumped circuit base sheets may be formed by alternative methods. One method involves the selective etching of a copper sheet to develop pits or cavities at predetermined locations. A thin plating layer is deposited on the base sheet, covering the surface including the depressions to form the mandrel. After passivation of the plated surface, copper is plated thereon to form the sheet with the bumps in place. This sheet is then peeled off the mandrel so that the mandrel may be reused for making subsequent bumped sheets. An alternative method of forming the reusable mandrel involves the selected build-up of a base metal sheet by plating with a compatible material about islands of photoresist. Thereafter, the photoresist is removed, leaving cavities where the islands had been. This surface is then plated with a thin layer of nickel to form the permanent mandrel.

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