Methods for producing smooth wafers

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

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C438S691000, C438S795000, C257SE21214

Reexamination Certificate

active

08058173

ABSTRACT:
Methods for reducing the surface roughness of semiconductor wafers through a combination of rough polishing and thermally annealing the wafer.

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