Microelectronic device wafers and methods of manufacturing

Details Microelectronic device wafers and methods of manufacturing Microelectronic device wafers and methods of manufacturing

2009-04-01

2011-11-22

Sarkar, Asok (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C257SE21237, C438S959000

Reexamination Certificate

active

08062958

ABSTRACT:
Methods of forming microelectronic device wafers include fabricating a plurality of semiconductor dies at an active side of a semiconductor wafer, depositing a mask on the semiconductor wafer, removing a central portion of the mask and the semiconductor wafer, and etching. The semiconductor wafer has an outer perimeter edge and a backside that is spaced from the active side by a first thickness. The mask is deposited on the backside of the semiconductor wafer and has a face that is spaced from the backside by a mask thickness. The thinned portion has a thinned surface that is spaced from the active side by a second thickness that is less than the first thickness, and the thinned surface is etched.

REFERENCES:
patent: 5674785 (1997-10-01), Akram et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 7098152 (2006-08-01), Moore
patent: 7169691 (2007-01-01), Doan
patent: 7332413 (2008-02-01), Kirby
patent: 7507638 (2009-03-01), Mancini et al.
patent: 2003/0020062 (2003-01-01), Faris
patent: 2003/0143819 (2003-07-01), Hedler et al.
patent: 2006/0003255 (2006-01-01), Wood et al.
patent: 2008/0014679 (2008-01-01), Shen et al.
patent: 2008/0242052 (2008-10-01), Feng et al.
Taiko Process, Disco Corporation, retrieved from the Internet on Feb. 23, 2009, <http:www.disco.co.jp/eg/solution/library/taiko.html>.
Kallender, P., “Fujitsu sculpts ultra-thin wafers for multichip packs,” EE Times, Dec. 4, 2001.

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