Method for manufacturing multilayer printed wiring board and...

Details Method for manufacturing multilayer printed wiring board and... Method for manufacturing multilayer printed wiring board and...

2005-08-09

2011-11-22

Vinh, Lan (Department: 1713)

Etching a substrate: processes

Nongaseous phase etching of substrate

C216S017000, C216S018000, C257S528000, C257S537000, C257S758000, C257S773000, C029S025420, C029S846000, C029S852000

Reexamination Certificate

active

08062539

ABSTRACT:
A method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy and the unnecessary dielectric layer is removed as large as possible; and a multilayer printed wiring board with an embedded capacitor circuit manufactured by the method.

REFERENCES:
patent: 4203257 (1980-05-01), Jamison et al.
patent: 5784782 (1998-07-01), Boyko et al.
patent: 6185354 (2001-02-01), Kronz et al.
patent: 6349456 (2002-02-01), Dunn et al.
patent: 6573584 (2003-06-01), Nagakari et al.
patent: 8125302 (1996-05-01), None
patent: 9116247 (1997-05-01), None
patent: 2000-133916 (2000-05-01), None
patent: 2000-323845 (2000-11-01), None
patent: 2005-534791 (2002-10-01), None
patent: 2003-11270 (2003-01-01), None
patent: 2003-243795 (2003-08-01), None

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