Process of forming ultra thin wafers having an edge support...

Details Process of forming ultra thin wafers having an edge support... Process of forming ultra thin wafers having an edge support...

2007-07-20

2011-11-01

Vu, Hung (Department: 2811)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S977000

Reexamination Certificate

active

08048775

ABSTRACT:
A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.

REFERENCES:
patent: 6162702 (2000-12-01), Morcom et al.
patent: 7507638 (2009-03-01), Mancini et al.
patent: 7592235 (2009-09-01), Nanjo

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