Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2009-07-13
2011-10-18
Clark, Sheila (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S780000
Reexamination Certificate
active
08039972
ABSTRACT:
A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
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Jung Ky-hyun
Kim Heui-seog
Kim Sang-jun
Ko Jun-young
Sin Wha-su
Clark Sheila
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
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