Microelectronic device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S051000, C438S053000, C257S704000, C257S710000, C257SE21001

Reexamination Certificate

active

08043880

ABSTRACT:
One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.

REFERENCES:
patent: 6635509 (2003-10-01), Ouellet
patent: 7067344 (2006-06-01), Oguchi
patent: 2004/0020782 (2004-02-01), Cohen et al.
patent: 2004/0100677 (2004-05-01), Huibers et al.
patent: 2004/0161871 (2004-08-01), Omori
patent: 2005/0263866 (2005-12-01), Wan
patent: 2006/0176487 (2006-08-01), Cummings et al.
Mund et al., Novel Microstructuring Technology for Glass on Silicon and Glass-Substrate, Electronic Components and Technology, IEEE 2004, pp. 939-942.
Mund, Dietrich, Novel Microstructuring Technology for Glass on Silicon and Glass-Substrates, 2004 Electronic Components and Technology Conference, IEEE, 2004, p. 939-942.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Microelectronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4270649

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.