Method of forming a bond pad

Details Method of forming a bond pad Method of forming a bond pad

2010-08-09

2011-10-25

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S618000, C438S638000, C438S672000, C438S673000

Reexamination Certificate

active

08043961

ABSTRACT:
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.

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patent: 2008/0233733 (2008-09-01), Lin

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