Microelectronic connection component

Details Microelectronic connection component Microelectronic connection component

2006-10-13

2011-10-18

Im, Junghwa M (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S787000, C257S697000, C257S666000, C257S678000, C257SE23031

Reexamination Certificate

active

08039959

ABSTRACT:
A microelectronic connection component includes a substrate having a first surface, a second surface and a peripheral edge. First and second terminals are exposed at the first surface of the substrate. Wire bond pads are exposed proximate the peripheral edge of the substrate at the first surface. First conductive paths couple the first terminals to the wire bond pads. Bonding leads extend beyond the peripheral edge of the substrate. Second conductive paths couple the second terminals to the bonding leads.

REFERENCES:
patent: 6373131 (2002-04-01), Karnezos
patent: 6489682 (2002-12-01), Yeh et al.
patent: 6812580 (2004-11-01), Wenzel et al.
patent: 6836011 (2004-12-01), Azuma
patent: 2004/0027869 (2004-02-01), Miwa et al.
patent: 2005/0022379 (2005-02-01), Rumsey et al.

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